With continued pursuit of innovation for more than 35 years, NAND flash memory has become an indispensable technology to capture data – the “new currency” of our digital world – fueling emerging paradigms in the world of AI, Cloud, and Edge Computing. Looking toward the future, KIOXIA’s BiCS FLASH™ 3D generations will continue to scale, enabling higher density and performance along with cost and power improvements. KIOXIA will lead the way and present cutting edge memory and SSD technologies, as well as highlight advanced developments to address the memory and storage needs for next-generation applications with innovations and optimizations rooted in flash-memory based technologies and approaches. No matter what your application, get there with KIOXIA.

The demand to accelerate artificial intelligence applications (AI apps) continues growing, especially for emerging workloads involving artificial neural networks like generative AI. Current AI Chips simulate neural networks for AI apps using a processor (GPU), memory (HBM), and software, but architectural inefficiencies waste significant amounts of performance and power. Next-generation AI Chips will use totally new AI Chip technology to perform neural network operations inside 3D DRAM, enabling 100x higher performance and 99% lower power consumption. New 3D architectures have the potential to enable the next wave of AI applications with more innovative memory and storage solutions.

Generative AI, which is currently a hot topic, is evolving into GPT4, multilingual reasoning, and coding capabilities, and is expected to ultimately bring about transformations such as the "Industrial Revolution." SK hynix AI memory plays a pivotal role in AI chips, which is the core background of Generative AI, by providing differentiated values in the AI era. With the rise of Generative AI, customer pain-points are becoming more specific such as ① To maximize the learning/inferencing amount per hour; ② To minimize power consumption for learning/inferencing; ③ To minimize floor space and power utilization for storing data, which is increased for Gen AI use. As memory & storage plays a pivotal role in AI technology, SK hynix is committed to continuous innovation and technological breakthroughs to solve customer pain-points in AI memory & storage development and aims to contribute to the advancement of the ICT industry by providing world-best AI memory products and strengthening collaboration with global partners.

As we enter a new phase of the AI revolution, significant technological advancements are reshaping the way we think about computation and data processing. The rapid growth in data generation and complex workload requirements has led to increased computational power, enabling the development of sophisticated, large-scale AI models. This shift necessitates advanced GPUs and enhanced memory and storage solutions for learning and inference. These solutions must provide substantial bandwidth, power-efficiency, and durability to maintain checkpoints and support proliferated multimodal AI models. Concurrently, there is a need to address sustainability challenges, such as increased power and cooling demands within data centers. In this keynote, we will explore cutting-edge memory products and technologies essential for various AI applications, highlighting how NAND solutions and CXL memory modules can be tailored to optimize performance across each application. We will discuss how these technologies meet and drive the demand for high-capacity storage in AI computing, aiming to improve Total Cost of Ownership (TCO) through enhanced power efficiency and effective space management. Some of the main technologies we will cover include cutting-edge DRAM technologies such as 256GB RDIMM/512GB MRDIMM and CXL 3.1 memory modules. We will also discuss high-bandwidth PCIe Gen6, enabling high-speed data access and reliability to enhance GPU efficiency.

Today Hyperscale’s wield significant influence over flash storage consumption, with a handful of vendors commanding much of the market. Amidst this dominance, the surge of AI applications stands as a pivotal force, reshaping infrastructure demands at an unprecedented pace. This keynote presentation delves into the intersection of hyperscale growth, AI expansion, and flash storage evolution. Exploring the symbiotic relationship between infrastructure advancements and flash storage requirements, we dissect the implications for standardization efforts, particularly through initiatives like the Open Compute Project (OCP). Moreover, we unravel the novel features essential for flash storage to meet the soaring demands of hyperscale environments, offering insights crucial for navigating the future of storage technology.

In the rapidly evolving landscape of artificial intelligence (AI), data has become the new gold. The need to protect the data and the underlying infrastructure from a myriad of threats has never been more pressing. We will look at the challenges that organizations face, the complexities of security from the ground up and provide key strategies to mitigate risk in a post-quantum world. We will examine the unique vulnerabilities inherent in AI infrastructure, from data pipelines and machine learning models to the compute resources that power them. The discussion will highlight how these vulnerabilities can be exploited by adversaries to compromise the integrity, confidentiality and availability of AI systems. We will highlight real-world scenarios where security breaches have led to significant consequences, underscoring the importance of a proactive and comprehensive security strategy. We will introduce a multi-layered approach that encompasses the latest in cybersecurity best practices, tailored specifically for the nuances of AI systems. We’ll look at security for data at rest and in transit and protecting model integrity. We will also consider the implications of quantum computing and what is needed to address those challenges. Attendees will gain an understanding of the key issues and strategies to secure their AI infrastructure effectively and how Microchip is working across our portfolio and within the industry to create a complete security solution for protecting the world’s data.

With the new era of NAND being driven by new industry dynamics Western Digital Executive Vice President & General Manager, Flash Business, Robert Soderbery, will discuss how the focus has shifted towards optimizing supply and demand, ensuring products meet customer needs, and navigating a market that is increasingly complex and segmented. He will share important insights on the critical role of storage in the AI data center all the way to the edge. Finally, Robert will reveal next-generation products and technologies fueling growth across the entire data cycle.

In the rapidly evolving landscape of AI, data drives our insights, decisions, and innovations. This keynote will highlight the key role that Micron storage and memory play in this dynamic ecosystem, starting with the data center's role in enabling AI. As AI applications expand into every corner of our lives, they will rapidly exceed the confines of the data center to the edge - the car, the PC, the phone, and beyond – to deliver amazing real-time user experiences. Edge devices, equipped with advanced storage and memory capabilities, are playing a crucial role in bringing AI to the real world. We will explore how Micron’s leading technologies – such as HBM3E, high-capacity DDR5 DIMMs, high-performance NVMe™ SSDs, and high-capacity SSDs – are revolutionizing data center architectures, enabling faster, more power efficient ingestion, processing and analysis of vast data volumes. Join us as we look at Micron’s memory and storage innovation from cloud to edge and explore how AI is integrating seamlessly into our lives – enriching our future.

Artificial Intelligence is driving the implosion of data usage. Whether data is used for training or inference, it needs to be processed, secured, and stored. For both the Cloud and the Edge, AI will require high capacity, high performance, and low power characteristics of NAND storage as well as the cost-effectiveness of QLC NAND. In the coming years, new categories of AI servers, AI PCs, and AI smartphones will drive device growth. AI servers, AI PCs, and AI Smartphones will need the high performance of PCIe Gen 5 SSDs and UFS 4.0 solutions to optimize for AI storage performance. Silicon Motion, as a leading merchant supplier of SSD controllers and solutions, will discuss the current and future SSD controller innovations to address the evolving and unique requirements in cloud storage and edge devices and introduce how our latest technology and comprehensive product portfolio drive AI innovations in flash storage.

Embark on an exclusive journey with K.S. Pua, Chairman and CEO of Phison Electronics Corp., as we unveil a new enterprise brand - Pascari. Phison enterprise emerges as a beacon of innovation within the industry, pioneering revolutionary storage technologies tailored for seamless integration into the forefront of next-generation data centers. Engineered with an unwavering commitment to efficiency, Pascari sets the standard for rapid deployment, ensuring optimal performance and operational excellence. Join us for a glimpse into the future of storage solutions. This presentation will also explore Phison's innovative utilization of NAND flash technology to effectively mitigate the challenge of exponential data expansion in AI training, particularly in developing large-language models. By harnessing the power of NAND flash, Phison empowers applications to achieve unprecedented milestones, enabling them to deliver responses from generative AI models that rival human-like capabilities.

Learn how advancements in AI and the demand for adding GPUs to servers is driving changes in server architecture. These demands are driving larger physical size and power supply capacity in AI focused server architectures. One way to resolve these competing requirements is to disaggregate the storage into its own chassis. We demonstrate how this can be done without sacrificing any performance to the GPU infrastructure utilizing NVMe-oF technology.

Software-Defined Memory (SDM) addresses the next wave of memory solutions to address the challenges of the “memory wall”. It performs like local memory, scales linearly, and works on any hardware - right now. In this talk, Kove and Red Hat will show how Software-Defined Memory technology has arrived. Red Hat will illustrate technology and operational benefits based on empirical test results of Kove:SDM™ configured on Red Hat OpenShift application platform using StressNG, Intel P- States, and standard Supermicro server hardware. Our comprehensive test data shows power savings from 12-54%, near-local CPU performance, and superior performance from remote memory compared to local memory. We’ll show real world use cases in multiple industry sectors that demonstrate Kove’s pooled memory solution Kove:SDM™ working on existing infrastructure, with no code changes. We’ll close with a leading expert from Swift discussing how they are changing the game for preventing economic crime for their customers with Kove:SDM™, where the stakes couldn’t be higher.